Included in the package is a high performance PWM controller capable of switching at 600 kHz, power MOSFETs, an inductor, and all the passive components required for a complete DC/DC power solution. The ISL8201M simplifies power supply design as only minimal external components are needed to implement a complete power solution.
This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, wireless network systems, medical and instrumentation, and point-of-load applications based on distributed-bus architecture. Also, an onboard input filter supports ultra-low noise operation thus reducing EMI.
Other features include internal compensation, internal soft-start, auto-recovery over-current protection, an enable option, and pre-biased output start-up capability.
The high integration and performance of the ISL8201M is housed in a tiny 15mm x 15mm x 3.5mm QFN package that is designed to offer optimum heat transfer through the PCB for excellent thermal performance. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules, thereby eliminating the need for heat sinks. The QFN package improves adherence to the PCB and improves overall reliability of end products. Additionally, all functional pins are brought out on the sides to make probing and debugging easier.
