The low activity silver paste of SOL315 for new passivation layer cell designs helps improve a cell’s efficiency.
Heraeus Precious Metals North America Conshohocken vice president Andy London said, "This product helps to significantly improve output and efficiency by reducing the recombination of charge carriers."
SOL315 has reduced content of silver and when screen printed and fired onto passivated silicon wafers it does not penetrate the passivation layer.
The new paste demonstrates more than 15% of reduced consumption per cell for new passivation layer cell designs when compared to conventional metallization pastes.
SOL315 can be used for front-side floating busbars and back-side soldering pad applications.
