In order for device performance to keep pace with Moore’s Law, integrated circuit designers have had to drive node-to-node reductions in interconnect-related RC delay. Achieving this performance scaling has become increasingly challenging as interconnect spacing has decreased below 45nm. Over the past several years, researchers have studied alternative materials and more complex integration schemes in order to meet the RC scaling challenge. While effective in a research environment, most of these materials and processes have faced challenges in terms of cost and production control when transferred to high volume manufacturing.
RC scaling is about keffective, not the absolute k value of each layer, said Mandyam Sriram, director of technology for Novellus’ PECVD business unit. Today the fastest and most advanced devices in the industry use Novellus dielectric films. We offer proven, high volume manufacturing-ready solutions to design-in capacitance reduction, with both an ease of integration and a low cost-of-ownership for our customers.
Novellus is a US-based provider of advanced process equipment for the global semiconductor industry.
