Combining best in class coat and develop uniformity with exceptional edge bead performance makes the second generation of ACS300 the preferred solution for various special spin coating applications such photosensitive polymers like polyimide, PBO or Cyclotene (BCB).
The second generation of ACS300 continues the success of the preceding model, ACS300Plus with developments driving equipment cost down, extending overall equipment efficiency and scaling down of the footprint.
“Addressing the specific requirements for wafer level packaging and 3D integration the new ACS300 is equipped with various packaging specific features, which makes it specifically suited for applications like solder bumping, gold bumping or redistribution layers,“ said Rolf Wolf, general manager of SUSS MicroTec Lithography Division. “The next generation ACS300 will definitively help SUSS MicroTec to continue and further expand its market leading position in the field of advanced packaging, and extending it into 3D processing.”
