As end users demand increasingly better audio experiences on the move, portable devices like MP3 players, notebook computers, PDAs, and cellphones are judged according to higher audio-quality metrics, like the stereo channel separation. Wide separation is acknowledged by the audiophiles to offer a better listening experience; home-audio equipment can easily attain this separation by ensuring a large distance between the speakers. To overcome physical restrictions of the portable form factors, the new TS4999’s 3-dimensional audio creates the effect of broad channel separation. Additionally, selectable 3D modes enable the audio image to be focused behind, above or below listener that can also enhance performance and comfort for the headphone users.
Combined with the low minimum supply voltage of 2.4V the new TS4999’s high efficiency also enables battery-powered products to operate for longer before recharging. A 10nA power-saving mode also decreases battery drain when the audio features are not being used.
The new TS4999 meets high standards for output power and distortion, by delivering up to 2.8 Watts per channel into 4-Ohm speaker loads and achieving distortion of 1%. Its high power-supply rejection ratio also prevents power-supply noise from entering the audio signal.
The TS4999 is delivered in an 18-bump flip-chip lead-free package. The new IC is in full production and is available at $1.10 in quantities of 1000 pieces.
