“AIXTRON’s leading market position in thin-film deposition equipment for the semiconductor industry provides an excellent platform for competitive development of new phase change material by AVDR technique for next-generation, high-density confined cell PCM device structures,” said Tyler Lowrey, president and chief executive officer of Ovonyx. “We look forward to working with AIXTRON to develop conformal deposition processes that will further enhance the commercialization of PCM products by worldwide chipmakers.”
“PCM is on the verge of commercial adoption using conventional sputter Physical Vapor Deposition (PVD) techniques, however, it is clear that subsequent generation PCM cells would significantly benefit from Atomic Vapor Deposition of phase change materials to further increase scalability and accelerate cost reductions,” said Bernd Schulte, executive vice president and chief operating officer of AIXTRON. “We believe that, working with Ovonyx, we can accelerate commercialization of AVDR phase change material deposition into high volume production and offer chip manufacturers higher productivity and low cost of ownership solution.”
About PCM Technology:
Ovonyx and its largest shareholder, Energy Conversion Devices, invented and pioneered the development of PCM technology, thereby gaining a fundamental understanding of PCM operation, including PCM devices, materials, processing, design, modelling, and performance. Ovonyx PCM technology uses a reversible phase-change memory process that provides for high performance, dense, array-addressed semiconductor memory technology that can be used as cost effective Flash and DRAM device replacements, as well as in embedded applications such as microcontrollers and reconfigurable MOS logic.
