Atmel Corporation (Atmel), a US-based manufacturer of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and RF components, has introduced a new system-in-package (SiP) solution, LIN IC ATA6617, for LIN automotive networking applications. The new ATA6617 integrates company's LIN system basis chip (SBC) ATA6624 incorporating LIN transceiver, voltage regulator, watchdog and an AVR microcontroller, ATtiny167 with 16k flash memory, in a single package.
The new ATA6617 features maximum integration and is the first member of new LIN SiP family. With this new highly integrated solution, the customers can create complete LIN nodes utilizing just one IC.
The new LIN SiP is based on the company’s second-generation LIN IP with superior EMC and ESD performance. It is optimized for the low-cost LIN slave applications and allows system cost reductions of up to 25%. A powerful LIN UART with the integrated hardware routines simplifies the protocol stack handling and limits interrupt generation, thus decreasing the microcontroller load and the flash memory consumption. The simple assignment of an individual physical LIN node address that is important in applications like air-conditioning systems can be realized by utilizing an integrated 100 microampere current source.
One important criterion for the LIN applications is the low current consumption. To ensure that the LIN node’s current consumption is well below the 100 microampere in applications that are continuously associated to the battery, the ATA6617 offers many current saving modes where different functionalities are individually switched off or on, depending on application requirements.
All pins of LIN system basis chip and microcontroller are bonded out, thus offering the customers the same flexibility and the performance for their applications as with the discrete parts.
The new ATA6617 has extremely small QFN38 package, measuring only 5 mm x 7 mm. With the new ATA6617 designers can save over 50% of PCB size compared to conventional solutions.