Lam Research Corporation (Lam Research) has been selected by Robert Bosch GmbH (Bosch) to provide its TCP 9400DSiE deep silicon etch system. The new system's high-density TCP plasma source offers configurations to meet challenges of silicon deep reactive ion etch. The new system provides wide process capability and the flexibility for a broad range of micro-electromechanical systems (MEMS), advanced packaging, and power semiconductor applications.

The Bosch name is synonymous in the industry with deep silicon etch technology, so we are extremely pleased our TCP 9400DSiE etch system has been qualified by Bosch, stated Marshall Benham, MEMS product line head at Lam Research. This decision signals the need for production-proven solutions in growing MEMS segments that are transitioning to volume manufacturing. These customers expect the highest degree of technology embedded on manufacturing-worthy platforms.

The TCP 9400DSiE system is based on company’s TCP 9400 silicon etch series with over 1,500 chambers deployed worldwide. Optimized source and chamber hardware offer superior profile control, cross-wafer symmetry, and repeatability that are important for ensuring high yield in MEMS devices. Integration of the company’s new in situ chamber cleaning technology allows excellent etch rate stability and high uptime. These proven capabilities help MEMS manufacturers’ ramp new applications quickly to high-volume production.

Lam Research Corporation is a US based supplier of semiconductor wafer fabrication equipment and services.

Bosch is a Germany based manufacturer of MEMS sensor, specializing in automotive sensors and consumer devices.