These new imaging products are two of several products Toshiba announced that expand the company’s Mobile Strategic Initiative, a product and customer support program designed to facilitate ease of design for new mobile phones and other portable devices.
As the overall sophistication of mobile handsets increases, so do the requirements of the camera solutions in these devices, said Andrew Burt, vice president of the Imaging and Communications Marketing Group in the ASSP Business Unit at TAEC. We are excited to deliver these new products in our advanced 1.75-micron process technology, which allows us to support higher pixel counts in smaller form factors as well as help minimize power consumption in imaging solutions.
The 8MP Dynastron image sensor (part number ET8ER4-AS) is designed for use in high-end camera phones that offer auto-focus or optical zoom capabilities. It is available in a 1/2.5-inch optical format, making it a strong fit for mobile phone camera designs where small size is critical. The sensor is optimized for performing in low-light environments.
The 2MP CSCM uses Toshiba’s through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing to reduce the module’s size by as much as 64 percent in comparison to other camera modules. It features an integrated image signal processing function to give the CSCMs more digital still capture-type functionality.
Pricing and Availability
Engineering samples of the 8MP image sensor are available now, with mass production scheduled to begin in the second quarter (Q2) of 2009. It is sample priced at $20 each. The 1/5-inch format 2MP CSCM will be in mass production in Q2 2009 and is sample priced at $10 each.
