FSI International, Inc. (FSI International) has received an additional order for its new ORION single wafer cleaning technology from a semiconductor manufacturer. The order provides expanded cleaning capacity and capability beyond the original order, announced on December 23, 2008. The additional purchase was motivated by the excellent on-site performance of the currently installed ORION tool. The ORION system will be used in manufacturing for BEOL fabrication of copper/low-k interconnects.

“This order is especially important to us as it validates the use of our ORION technology in manufacturing,” said Don Mitchell, FSI’s president and chief executive officer. “This customer had initially evaluated our new single wafer technology for BEOL 32nm processes. Their experience with the ORION system’s performance was sufficient for them to extend its value to existing manufacturing. The order reassures us that, even in the current industry downturn, our customers are willing to invest in new technology that delivers superior performance and clear economic benefits.”